New York Admissions Process

The steps for applying to our New York programs are listed below.

 

Day School and Supplemental Program

Step 1: Attend an Open House or schedule a school tour.

Step 2: Complete and mail the Application Form with the non-refundable registration fee by January 15*.
For returning students, the deadline for submitting the Returning Student Application Form is March 1.

Step 3: Arrange to have the Teacher Recommendation and Transcript Release form mailed to the school by January 31.

Step 4: For families interested in applying for Financial Aid, submit documentation online or by mail to School & Student Services (SSS).

Step 5: Applicants will be contacted for a playgroup evaluation or assessment.

Step 6: Acceptance notifications will be mailed no later than February 28. Placement priority will be given to returning students and siblings.

Step 7: For accepted students, contract/paperwork and non-refundable deposit are due by March 16.

 *After the January 15 deadline, late applicants may be considered based on class availability. 

 

After School Program

The After School program begins in September and runs throughout the school year. Applications are due on April 16 with a non-refundable deposit (15% of tuition) to hold a space.


Tuition Rates

For 2014-2015 NY tuition, please contact Noemi Ali, Admissions Director, at nali@bilingualbuds.com, or call (212) 787-8088.

For accepted families, a deposit is due by March 16.  15% of the tuition fee is due two weeks after the reception of the official acceptance in order to hold a spot at the appropriate level.  There is a 3% Early Payment Discount if tuition is paid in full by April 22. The first installment of tuition (less deposit) is due May 31 if not on the early payment plan. For families interested in applying for Financial Aid, please click here.







If you have any questions about applying to Bilingual Buds, or would like help during the admissions process, please contact Noemi Ali, Admissions Director, at nali@bilingalbuds.com.